NEWS: ProSys Announces Replacement for legacy Verteq/Marteq Megasonic Sunburst. Find out more!

Published Papers

Megasonic Enhanced Photo Resist Removal Using Unique Solvent Free Phase-Fluids on an Advanced Single Wafer Resist Processing System

by Don Dussault, M. Weinhart, T. Zenger and I. Eichinger

Megasonic Enhanced Photoresist Strip with DiO3

by Don Dussault, Jens Fittkau and Christiane Gottschalk / UCPSS

Use of a Simple Cavitation Cell Set-up with Replaceable Single Band Filters for Analysis of Sonoluminescence Signal from Megasonic Irradiated Gasified Aqueous Solutions

by Zhenxing Han, Manish Keswani, Eric Liebscher, Mark Beck and Srini Raghavan / ECS

Advanced Process Control in Megasonic-Enhanced Pre-Bonding Cleaning

by D. Dussault, F. Fournel, and V. Dragoi / ECS

Direct vs. Indirect Megasonic Tank Cleaning Systems; Uniformity, Cleaning Efficiency and Cost of Ownership

by J. Desagher, D. Dussault, M. Beck, R. Lillard, E. Liebscher / UCPSS

Acoustic Energy: A New Tool for MEMS Manufacturing

by D. Dussault and V. Dragoi / MRS

Aligned Fusion Wafer Bonding for CMOS-MEMS and 3D Wafer-level Integration Applications

by V. Dragoi, G. Mittendorfer, C. Flötgen, D. Dussault and T. Wagenleitner / ROMJIST

RELATED ARTICLES

presenting

additional

research

Control of Sonoluminescence Signal in Deionized Water Using Carbon Dioxide

by S.Kumari, M.Keswani, S.Singh, M.Beck, E.Liebscher, P.Deymier, S.Raghavan / MEE

High Efficiency Single Wafer Cleaning for Wafer Bonding-based 3D Integration Applications

by D. Dussault, F. Fournel and V. Dragoi / UCPSS

Damage-Free Cleaning of Sub-50 nm Devices Using Direct Megasonics Technology in a Single Wafer Processor

by J. J. Rosato, M. R. Yalamanchili, M. J. Beck, R. Y. Lillard / UCPSS

Fabrication of High Aspect Ratio SU-8 Structures Using UV Lithography and Megasonic-Enhanced Development

by D. Figura and J. Bartel / ECS

Novel Photolithography Yield-Enhancement Technique: Megasonic-Enhanced Development

by V. Dragoi, J. Bartel, and D. Dussault / ECS

Innovative Megasonic Cleaning Technology Evaluated Through Direct Wafer Bonding

by F. Fournel, L.Bally, D. Dussault, and V. Dragoi / ECS

Megasonic Metrology for Enhanced Process Development

by S. Kumari, M. Keswani, M. Beck, E. Liebscher, T. Liang, P. Deymier, and S. Raghavan / ECS

Control of Sonoluminescence in Carbon Dioxide Containing DI Water at Near Neutral pH Conditions

by Sangita Kumari, Manish Keswani, Satish Kumar Singh, Mark Beck, Eric Leibscher, Pierre Deymier and Srini Raghavan / UCPSS

Improving Megasonic Exposure Uniformity for EUV Mask Substrate Cleaning

by Matthew House, Abbas Rastegar, Don Dussault, Eric Liebscher / ECS

Effect of Dissolved CO2 in De-ionized Water in Reducing Wafer Damage During Megasonic Cleaning in MegPie®

by S. Kumari, M. Keswani, S. Singh, M. Beck, E. Liebscher, L. Q. Toan and S. Raghavan / ECS

SU-8 Intermediate Layers Wafer Bonding for Microfluidic Devices Fabrication

by V. Dragoi, G. Mittendorfer, C. Thanner, D. Dussault and M. Wimplinger

MEET US AT SEMICON SEA

Meet the ProSys Team at SEMICON SEA 2025!
May 20–22, 2025
Sands Expo & Convention Centre, Singapore

We’re excited to be exhibiting in collaboration with our Southeast Asia representative, Semiconductor Technologies Singapore.

Find us at Booth B1509
Stop by to discover our latest innovations and connect with our experts!

Feel free to contact us ahead of time to arrange an appointment. We’re excited about the opportunity to meet with you!

CONTACT US