Single Wafer
Typical applications
- FEOL / BEOL cleans (Particles < 20 nm to > 10 µm)
- Post CMP & polish cleaning
- Pre-bond / Post De-Bond cleans
- Mask cleaning
- Photoresist Develop / Strip / MLO
- TSV / VIA residual polymer removal
Substrate sizes
- Round: 75 mm to 450 mm
- Square: Up to 450 mm
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