NEWS: ProSys Announces Replacement for legacy Verteq/Marteq Megasonic Sunburst. Find out more!

MegPie® V4

The MegPie® V4 economically delivers outstanding non-contact cleaning for backside scrubber applications. It is based on the proven MegPie® V3 design and specifically adapted to fit backside scrubber application requirements.

High Performance

  • Incorporates MegPie® V3 transducer construction that achieves 98% particle removal down to 19nm
  • Fluid delivery manifold allows up to 100 RPM to eliminate fluid wrap
  • RS-232 connectivity for streaming forward power, alarms and warnings

Robust Components

  • Sapphire resonator is particle neutral and compatible with process chemistry
  • NanoPower™ electronics provides max. 50W continuous wave RF at nominal 925 kHz
  • Transducer assembly uses patented crystal bonding and RF circuitry connections

Simplified System

  • Matching network is internal to the MegPie® V4
  • RTD and purge connections are not required
  • NanoPower™ features front panel input and compact half-rack 2.5U form factor 300mm wafer

Better Alternative to Brushes and Nozzles

The MegPie® V4 enables the removal of both smaller particles and more particles, in order to meet the tighter requirements of advanced nodes — supporting the industry roadmap for backside scrubber applications.

Legacy Brush and Nozzle Issues

Single-Wafer Brush Issues

  • Not particle neutral, adders increase with brush aging
  • Contact allows for cross contamination (lot-to-lot, wafer-to-wafer)
  • Throughput, downtime for brush changes
  • Brush requalification after change
  • Repeatability of process
  • Monitoring of process parameters

Binary Nozzles Issue

  • Accelerated fluid droplets knock particle away
  • Force applied limited by droplet mass and momentum
  • No direct process feedback/control
  • Limited process applications:
  • Standard SC1 Chemistry (not possible via nozzle)
  • Post-CMP cleaning (hard cleans) limited
  • High Temperature Processes not Possible

Test Results

Summary and Conclusions of a Partner comparing brush, binary nozzle, and the MegPie® for PRE. Fresh and aged wafers were compared for particle removal efficiency (PRE). Equipment used was a Screen 80B Tool retrofit with the MegPie® Kit.

  • The MegPie® outperforms brush and binary nozzle cleaning technologies

Get in touch with us!

Contact us for product demos, cleaning solutions, distributor opportunities, or any queries about our company and products. Let’s start the conversation and find the answers you need.

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MEET US AT SEMICON SEA

Meet the ProSys Team at SEMICON SEA 2025!
May 20–22, 2025
Sands Expo & Convention Centre, Singapore

We’re excited to be exhibiting in collaboration with our Southeast Asia representative, Semiconductor Technologies Singapore.

Find us at Booth B1509
Stop by to discover our latest innovations and connect with our experts!

Feel free to contact us ahead of time to arrange an appointment. We’re excited about the opportunity to meet with you!

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