ProSys Announcement: BevelSonic – A Patented Breakthrough in Contactless Edge Bevel Processing. FIND OUT MORE!

Contactless edge bevel processing with Bevelsonic

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BevelSonic

Contactless edge bevel processing with patented focused sound technology

  • Particle and debris removal
  • Organics removal
  • Wet etch enhancement

The breakthrough in edge bevel cleaning technology

Advantages

  • ProSys patented „focused acoustic energy“ Technology: Significantly more efficient bevel cleaning
  • No wafer-to-wafer contamination
  • No risk of damage or chipping to the wafer bevel
  • Localized application of cleaning process = Low fluid consumption. Uses 0.1 to 0.3 LPM at 1 to 50 RPM, ca. 570g
  • For horizontal substrate processing
  • Alternative to brush systems
  • Compatible with a wide range of process chemistries

The original, patented

BevelSonic: Mastering non-contact edge bevel processing

Options for BevelSonic

  • For 200 mm and 300 mm round substrates
  • Material options: PTFE / Stainless Steel or PTFE / Sapphire
  • Slot design is 2mm for 0.68 thick wafer. This slot can be changed for a bonded pair or for wafer wobble
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