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Published Conference Papers

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Megasonic Enhanced Photo Resist Removal Using Unique Solvent Free Phase-Fluids on an Advanced Single Wafer Resist Processing System
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by Don Dussault,M. Weinhart, T. Zenger and I. Eichinger
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Megasonic Enhanced Photoresist Strip with DiO3
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by Don Dussault, Jens Fittkau and Christiane Gottschalk
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Use of a Simple Cavitation Cell Set-up with Replaceable Single Band Filters for Analysis of Sonoluminescence Signal from Megasonic Irradiated Gasified Aqueous Solutions

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by Zhenxing Han, Manish Keswani, Eric Liebscher, Mark Beck and Srini Raghavan
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Advanced Process Control in Megasonic-Enhanced Pre-Bonding Cleaning
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by D. Dussault, F. Fournel, and V. Dragoi
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Direct vs. Indirect Megasonic Tank Cleaning Systems; Uniformity, Cleaning Efficiency and Cost of Ownership
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by J. Desagher, D. Dussault, M. Beck, R. Lillard, E. Liebscher
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Acoustic Energy: A New Tool for MEMS Manufacturing
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by D. Dussault and V. Dragoi
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Aligned Fusion Wafer Bonding for CMOS-MEMS and 3D Wafer-level Integration Applications
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by V. Dragoi, G. Mittendorfer, C. Flötgen, D. Dussault and T. Wagenleitner
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Damage-Free Cleaning of Sub-50 nm Devices Using Directed Megasonics Technology in a Single Wafer Processor

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by J. J. Rosato, M. R. Yalamanchili, M. J. Beck, R. Y. Lillard

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Control of Sonoluminescence Signal in Deionized Water Using Carbon Dioxide
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by S.Kumari, M.Keswani, S.Singh, M.Beck, E.Liebscher, P.Deymier, S.Raghavan

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High Efficiency Single Wafer Cleaning for Wafer Bonding-based 3D Integration Applications
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by D. Dussault, F. Fournel and V. Dragoi / download PDF (468 KB)
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Fabrication of High Aspect Ratio SU-8 Structures Using UV Lithography and Megasonic-Enhanced Development
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by D. Figura and J. Bartel
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Novel Photolithography Yield-Enhancement Technique: Megasonic-Enhanced Development
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by V. Dragoi, J. Bartel, and D. Dussault
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Innovative Megasonic Cleaning Technology Evaluated Through Direct Wafer Bonding
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by F. Fournel, L.Bally, D. Dussault, and V. Dragoi

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Acoustic Energy: a New Tool for MEMS Manufacturing
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by D. Dussault and V. Dragoi
/ download PDF (11 MB)
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Control of Sonoluminescence in Carbon Dioxide Containing DI Water at Near Neutral pH Conditions
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by Sangita Kumari, Manish Keswani, Satish Kumar Singh, Mark Beck, Eric Leibscher, Pierre Deymier and Srini Raghavan

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Megasonic Metrology for Enhanced Process Development
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by S. Kumari, M. Keswani, M. Beck, E. Liebscher, T. Liang, P. Deymier, and S. Raghavan

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Improving Megasonic Exposure Uniformity for EUV Mask Substrate Cleaning
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by Matthew House, Abbas Rastegar, Don Dussault, Eric Liebscher

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Effect of Dissolved CO2 in De-ionized Water in Reducing Wafer Damage During Megasonic Cleaning in MegPie®
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by S. Kumari, M. Keswani, S. Singh, M. Beck, E. Liebscher, L. Q. Toan and S. Raghavan
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SU-8 Intermediate Layers Wafer Bonding for Microfluidic Devices Fabrication
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by V. Dragoi, G. Mittendorfer, C. Thanner, D. Dussault and M. Wimplinger

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